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Huita Optoelectronic Material Co.,Ltd

All Products >> Sputtering Target

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tiox target
tiox target
Specification: &©|248;355,6 x 10 mm ; L4000mm
Detail: Formula: TiOx, where X is: 1.68-1.80. &©|248;355,6 x 10 mm ; L4000mm Preparation method includes: proportioning raw titanium oxide and Ti according to TiOx, where x is between 1.68-1.80 and mixed evenly; Forming by hot p...

2
silicon(si) sputtering target
silicon(si) sputtering target
Specification: 5N, 6N
Detail: Silicon aluminum rotating target Silica-aluminum ratio: 90:10 (wt%) or pure silicon, other ratios can be ***ermined as required. Purity: 4N Relative density: 2.1g/m3 Forming process: thermal spraying Specification: length...

3
molybdenum(mo) sputtering target
molybdenum(mo) sputtering target
Specification: 3N5
Detail: Element Symbol: Mo Purity: 3N5 Availble Shape: Planar target, Rotary target Specifications: customized according to customer requirements Production process: Molybdenum billet (raw material)- inspection - hot rolling - ...
Showing 1 - 3 of 3, total 1 pages        [First] [Previous] [Next] [Last]
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